BC30CCD112.5-32.768K,8038mm,32.768KHZ晶体,Bomar通信晶振,进口无源晶振,Bomar小体积晶振,欧美音叉晶体,陶瓷晶振,32.768KHZ无源晶体,无源贴片晶振,8038mm晶体谐振器,SMD晶体,尺寸8.0x3.8mm,频率32.768KHZ,负载12.5pF,耐热性晶振,高稳定晶振,高性能晶振,低损耗晶振,芯片卡晶振,移动设备晶振,无线通信晶振,记秒器晶振,实时实时晶振,智能手表晶振.
BC30CCD112.5-32.768K,8038mm,32.768KHZ晶体,Bomar通信晶振特点:
BC30系列是一种微型塑料smd晶体。卓越的抗冲击性和耐热性。
可能的应用包括移动通信、芯片卡、实时时钟和无线通信。
回流焊接
工作温度-40º至+85ºC。
BC30CCD112.5-32.768K,8038mm,32.768KHZ晶体,Bomar通信晶振 参数表
| Frequency Range | 32.768 kHz | |||||||||
| Frequency Tolerance @ 25ºC. | ±10ppm, ±20ppm, ±50ppm | |||||||||
| Temperature Coefficient | -0.040ppm / ºC² max. - See Graph Below | |||||||||
| Operating Temperature Range | -40º to +85ºC. | |||||||||
| Load Capacitance | 6.0 to 12.5pF | |||||||||
| Shunt Capacitance | 2pF max. | |||||||||
| Equivalent Series Resistance | 50k ohms max. | |||||||||
| Aging | ±5ppm/ 1styear max. | |||||||||
| Drive Level | 1.0µW max. | |||||||||
| Storage Temperature | -55º to +125ºC. | |||||||||
BC30CCD112.5-32.768K,8038mm,32.768KHZ晶体,Bomar通信晶振 尺寸图
百利贴片晶振,3215mm,BQCST-32K76F-YCDHT,32.768KHZ
CSM-8A,ECS-240-12-20A-TR,7050mm,24MHz,ECS陶瓷晶振
Q 16.0-JXS32-10-10/10-WA-LF,Jauch进口晶振,16.0MHz石英晶振
LFXTAL003000,IQD晶振,12.5pF,进口晶振
LFXTAL015822BULK,90SMX,6pF,IQD晶振
LFXTAL084882,欧美晶振,3215进口晶振,±20ppm
LFXTAL015822REEL,IQD无源晶振,低频晶振,90SMX晶振
RT2012-32.768-9-20-EXT-TR,2012进口晶振,拉隆晶振,无源晶振
RSE-32.768-6-H14-TR,陶瓷晶振,进口拉隆晶振,无源晶振
C1E-24.000-10-1010-R,24MHz,安基电子,SMD晶振
